QianLi Universal Leaded Solder 183℃

QianLi Mega-iDea universal leaded soldering wire with flux core. 0.8mm wire diameter, Sn 63%/Pb 37% alloy, melts cleanly at 183°C for general electronics rework and chip-level repair.

Low-residue flux core flows smoothly into joints and BGA pad work, and cleans easily with isopropyl alcohol. Net weight 10g per spool - enough for dozens of phone-board joints or BGA reballing sessions.

Pair with no-clean flux paste, solder wick and a quality temperature-controlled iron for clean BGA and surface-mount joints.