AMAOE BGA Reballing Stencil with CPU Position for iPhone 12 / 12 mini / 12 Pro / 12 Pro Max

This AMAOE stencil reballs the A14 CPU and the other logic-board chips on iPhone 12 / 12 mini / 12 Pro / 12 Pro Max. One 0.12mm sheet carries the CPU position and the surrounding IC openings, so the whole board job runs off a single stencil.

Features:

• CPU position for the A14 chip
• IC openings for the other logic-board chips on the same sheet
• 0.12mm thickness, printed on the sheet
• Model range printed on the sheet for quick picking at the bench

Package Includes:

• 1 x AMAOE BGA reballing stencil for iPhone 12 / 12 mini / 12 Pro / 12 Pro Max