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In Stock
$9.95
Ex GST:
$9.05
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- Product Code: AMAOE-STENCIL-16
This AMAOE stencil reballs the A18 / A18 Pro CPU and the other logic-board chips on iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max / 16e. One 0.12mm sheet carries the CPU position and the surrounding IC openings, so the whole board job runs off a single stencil.
Features:
- CPU position for the A18 / A18 Pro chip
- IC openings for the other logic-board chips on the same sheet
- 0.12mm thickness, printed on the sheet
- Model range printed on the sheet for quick picking at the bench
Package Includes:
- 1 x AMAOE BGA reballing stencil for iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max / 16e
