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This QianLi platform holds the middle layer of the iPhone 13 mini / 13 / 13 Pro / 13 Pro Max logic board for BGA reballing. It also works as a jig when separating and refitting the board layers for testing.
Features:
- Double-sided design reballs both sides of the middle frame
- Stencils hold their shape under soldering heat
- Strong magnetic hold keeps the board and stencil still
- Precise positioning lines the stencil up with the pads
- Speeds up middle frame reballing
- Durable build for daily bench use
Package Includes:
- 1 x QianLi 4 in 1 double-sided middle frame reballing platform
