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This AMAOE stencil reballs the A19 / A19 Pro CPU and the other logic-board chips on iPhone 17 / Air / 17 Pro / 17 Pro Max. One 0.12mm sheet carries the CPU position and the surrounding IC openings, so the whole board job runs off a single stencil.
Features:
- CPU position for the A19 / A19 Pro chip
- IC openings for the other logic-board chips on the same sheet
- 0.12mm thickness, printed on the sheet
- Model range printed on the sheet for quick picking at the bench
Package Includes:
- 1 x AMAOE BGA reballing stencil for iPhone 17 / Air / 17 Pro / 17 Pro Max
