BGA IC Reballing Stencil for iPhone X

BGA IC reballing stencil set for iPhone X logic-board chip-level repair. Heats with a hot air rework station to reflow the underside solder balls on common power, baseband, audio, Wi-Fi and CPU chips.

Laser-cut from heat-resistant stainless steel for precise pad alignment, with each cut sized to the exact BGA footprint of the iPhone X board. Reusable across many repairs and compatible with leaded or lead-free solder paste.

For micro-soldering technicians performing chip removal, cleaning and re-tinning. Pair with low-temp solder paste, no-clean flux and a quality hot air rework station for best results.