BGA IC Reballing Stencil for iPhone XR

BGA IC reballing stencil set for iPhone XR logic-board chip-level repair. Heats with a hot air rework station to reflow the underside solder balls on common power, baseband, audio, Wi-Fi and CPU chips.

Laser-cut from heat-resistant stainless steel for precise pad alignment, with each cut sized to the exact BGA footprint of the iPhone XR board. Reusable across many repairs and compatible with leaded or lead-free solder paste.

For micro-soldering technicians performing chip removal, cleaning and re-tinning. Pair with low-temp solder paste, no-clean flux and a quality hot air rework station for best results.